发明名称 IC LEAD BENDING PRESS
摘要 PURPOSE:To prevent an IC from damaging at positioning time and to rapidly position and discharge the IC by utilizing a vacuum pressure and pressurized air to position and discharge the IC. CONSTITUTION:A plug-in type miniature air cylinder 17 is mounted at the IC output side of a die holder 10, and a stopper pin 18 is coupled with the piston rod of the cylinder 17. Air passages 19, 19A, 19B are formed at the holder 10, the cylinder 17 of a lower die 11 and the position near the front stage of the pin 18. When the IC is stopped at and held at a lead bending position, a vacuum VA is operated through the passage 19 at the passages 19A, 19B to reduce an impact force when the IC collides with the pin 18 and to obtain rebound suppressing effect after the collision. When discharging the IC after bending the lead, pressurized air AR is fed to discharge the IC by an air jet in a direction of an arrow Y.
申请公布号 JPS62166551(A) 申请公布日期 1987.07.23
申请号 JP19860007949 申请日期 1986.01.20
申请人 FUJITSU LTD 发明人 KATO YUKIO;KATO KUNIO;KIMURA TATSUO
分类号 B21F1/00;H01L21/00;H01L23/50;H05K13/00 主分类号 B21F1/00
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