| 发明名称 |
VERFAHREN ZUR MONTAGE EINES LSI- BZW. IC-BAUSTEINS AUF EINER VERDRAHTUNGSUNTERLAGE |
| 摘要 |
A method of mounting an LSI or IC on a wiring circuit substrate by hot-pressing which comprises the steps of placing the pins of the LSI or IC on a heat sealant printed over the circuit pattern of the substrate, placing a film sheet on the entire or partial surface of the LSI chip or IC chip including the pins of the chip, and carrying out a hot-pressing operation on the film sheet. |
| 申请公布号 |
DE3701343(A1) |
申请公布日期 |
1987.07.23 |
| 申请号 |
DE19873701343 |
申请日期 |
1987.01.19 |
| 申请人 |
SHARP K.K. |
发明人 |
KOHARA,ICHIROU;OZAWA,KAZUHITO |
| 分类号 |
H01L21/603;H01L21/60;H05K1/09;H05K1/18;H05K3/28;H05K3/32;H05K3/34;H05K13/04;(IPC1-7):H05K3/32 |
主分类号 |
H01L21/603 |
| 代理机构 |
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代理人 |
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| 地址 |
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