A METHOD FOR PRODUCING AN ENCAPSULATED SEMICONDUCTOR USING A CURABLE EPOXY RESIN COMPOSITION

摘要

A curable epoxy resin composition comprising a novolak type epoxy resin which is produced from substituted phenol novolak and epihalohydrin and whose infrared spectrum, measured in 3% W/V dichloromethane solutiton using an infrared spectrophotometer of 2 mm cell length, has an absorbance of 0.15 or less in the frequency range from 3570 to 3600 cm<-><1>. The resin is useful particularly in encapsulating and laminating applications in electronic fields.