| 摘要 |
<p>A hybrid integrated circuit substrate for a motor is formed by an iron substrate (1), a resin layer (2) adhered on the same and a copper foil layer (3) adhered on the same. The resin layer (2) is formed of epoxy resin, and Kevlar fiber belonging to aromatic polyamide fiber is mixed therein in the form of cloth or paper. Thus, a clad formed by the resin layer (2) and the copper foil layer (3) has a thermal expansion coefficient close to that of the iron substrate (1), thereby to prevent warping caused in manufacturing of the hybrid integrated circuit substrate. The copper foil layer (3) is etched in prescribed configurations to form conductive paths (13), to which stator coils (5) and various circuit elements (14, 15) are connected.</p> |
