| 摘要 |
PURPOSE:To evaluate heat conductivity and to decide whether a soldering state is normal or not stably and accurately by detecting the heat conductivity of a soldering part without being affected by the heat capacity of a normal soldering part nor a difference in surface state. CONSTITUTION:The terminal 5 of a component 4 is heated by a heating device to melt solder 3, and thus soldered to a circuit pattern 2 on a circuit board 1. An infrared temperature detector 7 begins to measure the temperature of the terminal 5 right before this heating device 8 heats the terminal 5 and an infrared temperature detector 6 starts detecting the temperature of the solder 3. Temperature data measured by those detectors 6 and 7 are applied to an arithmetic circuit 10 to subtract the measured temperature of the solder 3 from the measured temperature of the terminal 5, thereby deciding whether or not the temperature difference is less than the permissible value of a normal soldering state. Then, a normal or defective soldering state is displayed on a display device 11 to decide whether the soldering state is normal or not.
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