| 摘要 |
PURPOSE:To enable the titled device to be adapted for the hybrid system satis factorily by a method wherein a bonding arm and a driving part are mounted on a shifting body to bond semiconductor pellets on multiple bonding positions on the shifting body or a substrate continuously at high speed. CONSTITUTION:Within an alignment device 9, pellet holders 15 positioned in the radial directions while pellets 2 are shifted by a sticking collet 10 are aligned with the pellets 2 held by the holders 15 after the pellets 2 are shifted. The aligned pellets 2 are held in sticking by a bonding arm 26 and another sticking collet 25 on a shifting body 21. Then a turntable 29 is turned to rotate a working arm 32 counterclockwise centered on a pin 31 operated by an operat ing pin 30 so that a bonding arm 26 may be advanced to position the collet 25 on an alignment base 14. Then the collet 25 is lowered and lifted by operat ing a lifting cam 28 to hold the aligned pellets 2 in sticking. Later, the collet 25 is lowered by operating the cam 28 to bond the pellets 2 held in sticking on the bonding positions of substrate 1.
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