| 摘要 |
<p>PURPOSE:To prevent the generation of concentrated stress in glass, a printed wiring board, a soldering section, etc. positively by mounting glass for a package in a type that the glass is floated on the printed wiring board through a projecting section for an electrode body. CONSTITUTION:Electrode bodies 18 have flat sections 18a for connection arranged separated from the lower surface of glass 6 through projecting sections 18b projected from the lower surface of glass 6 while penetrating the inside of glass 6, and are extended onto an apparatus body 1 through small holes 5, 5a in the apparatus body 1. Glass 6 is mounted onto a printed wiring board 11 in a floated type at a regular interval through the projecting sections 18b for the electrode bodies 18. Even when the difference of the thermal expansion coefficients of glass 6 and the printed wiring board 11 is large, the difference of the quantities of the thermal expansion (or the quantities of shrinkage on cooling) of both the glass 6 and the printed wiring board 11 can be absorbed by the projecting sections 18b for the electrode bodies 8. Accordingly, the glass 6 and the printed wiring board 11 are not constrained mutually, and expansion action or shrinkage action can freely be conducted independently.</p> |
