| 摘要 |
PURPOSE:To simply and easily connect chip-type electronic parts with wiring patterns, by forming contact holes at thin film parts in a resinous substrate and then forming wiring patterns which are connected with terminal electrodes of chip-type electronic parts through the contact holes on the surface of the resinous substrate. CONSTITUTION:Contact holes 4a... are formed by an etching process on thin films 4, which are parts included in a resinous substrate 1, and at the positions corresponding to electrode pads on a semiconductor chip 2 and electrode terminals 3a on a capacitor chip 3. Wiring patterns 5... are formed on the upper surface of the resinous substrate 1 by the etching resinous substrate 1. Partial wiring patterns are directly connected with respectively the electrode pads on the semiconductor chip 2 and the electrode terminals 3a on the capacitor chip 3. Hence, the chip-type electronic parts can be simply and easily connected with the wiring patterns without requiring a large-scale bonding apparatus. |
