| 摘要 |
PURPOSE:To form a latticed reinforcing material consisting of the same material as a mask substrate with a flat surface only by desired thickness by laminating a mask substrate material on a substrate, burying a latticed recessed section shaped by etching the surface of the substrate. CONSTITUTION:A section such as a section on an silicon substrate 1 corresponding to the section of a mask through which X-rays may not be transmitted is patterned in a latticed manner, and etched in desired depth, thus forming a recessed section 7a. The recessed section 7a is buried and a material for a mask substrate 2 is laminated only by desired thickness, and a flattening material 3 is laminated on the mask substrate 2 so that the surface is flattened. The flattening material 3 is removed completely so that the surface of the mask substrate 2 is exposed under conditions, in which the etching rates of a material layer for the mask substrate 2 and said flattening material 3 layer are equalized, such as the plasma etching of CF4+H2. A pattern 4 for exposure is formed onto said exposed mask substrate 2. Accordingly, a latticed reinforcing material consisting of the same material as the mask substrate is unified with the mask substrate, and can be shaped. |
