发明名称 HEAT DISSIPATION STRUCTURE
摘要 PURPOSE:To improve the efficiency of heat dissipation and thereby to enable the packaging of a high density by a construction wherein a hollow-cylindrical heat pipe is held between a heat pipe fixing plate and a heat pipe retaining plate by heat pipes threaded outside. CONSTITUTION:A heating body 1 is made to contact closely with a heat pipe fixing plate 9A by means of a heating body fitting plate 8A. A hollow-cylindrical heat pipe 3 is held between the heat pipe fixing plate 9A and a heat pipe retaining plate 10A, and these plates are fastened together by heat pipes 4A threaded outside. The heat resistance of the heat pipes is about 0.1 deg.C/W, better considerably than that of copper or aluminum, and the contact area is also increased by the formation of threads on the outside of the heat pipes. Since the heat pipes 4A threaded outside are employed, a heat emitted from the heating body 1 is transferred to the heat pipe retaining plate 10A through the heat pipes, and consequently the difference in temperature between the heat pipe fixing plate 9A and the heat pipe retaining plate 10A becomes very small. Thus, a structure thus obtained can be used as an excellent heat radiating adaptor.
申请公布号 JPS62154655(A) 申请公布日期 1987.07.09
申请号 JP19850294527 申请日期 1985.12.26
申请人 FUJITSU LTD 发明人 KOJIMA YASUSHI;ARAI KATSUSHI;TOYAMA MITSUSADA;SAKIURA JIYUN;SUZUKI MITSUAKI
分类号 H05K7/20;H01L23/427 主分类号 H05K7/20
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