| 摘要 |
<p>PURPOSE:To prevent adhesive from adhering to the surface of a wafer chip in the step of picking up a semiconductor wafer chip, by adding a light scattering inorg. compd. powder to the pressure-sensitive adhesive layer of a pressure- sensitive adhesive sheet composed of a pressure-sensitive adhesive layer provided on the surface of a substrate. CONSTITUTION:This pressure-sensitive adhesive sheet is obtd. by adding a light-scattering inorg. compd. powder to a pressure-sensitive adhesive layer comprising a pressure-sensitive adhesive and a readiation-polymerizable compd. provided on the surface of a substrate. Examples of the light-scattering inorg. compd. are silica powder, alumina powder, silica/alumina powder and mica powder. Preferred examples of the pressure-sensitive adhesive are acrylic adhesives. Preferred examples of the radiation polymerizable compd. are urethane acrylate oligomers. The blending ratio of the acrylic adhesive (a) to the urethane acrylate oligomer (h) in the adhesive layer is pref. 10-90:90-10 by weight.</p> |
