| 摘要 |
<p>PURPOSE:To reduce the number of bondings, contrive a higher productivity and prevent defective bonding from occurring by mounting a common-side driving transistor group and a decoder on an LED array chip. CONSTITUTION:LEDs 6 arranged on each LED array chip 3 are divided into a plurality of sets, and a matrix wiring 12 is provided on the LED array chip 3. Assuming that the number of the LEDs 6 mounted on the LED array chip 3 is 64, the number of individual electrodes 10 can be set to be '8', and the number of transistors 13 can be set to be '8', in which case the number of code input terminals 18 can be set to be '3'. With a decoder 17 intermediately provided, it is substantially sufficient to provide '8+3' bondings. Accordingly, productivity can be enhanced, and it is possible to reduce failures in bonding due to the low resistance of GaAs which is used as the material of the array chip, to strain.</p> |
