发明名称 METHOD FOR FIXING LEAD PIN IN CIRCUIT BOARD
摘要 PURPOSE:To improve work efficiency by a method wherein a multiplicity of lead pins are held in a fixing jig, the fixing jig comes down for the insertion of the lead pins through-holes provided in a circuit board, the lead pins comes further down to about against molten solder, and the lead pins are fixed tight in the through-holes with help of capillarity. CONSTITUTION:A lead pin 4 is held in a holder 5 in a fixing jig 1 of a fixing unit A for the fixation of the lead pin 4 to a circuit board 3. The holder 5 comes down for the insertion of the lead pin 4 into a through-hole 6 provided in the circuit board 3. A heating element 2 of the fixing unit A is installed, vertically slidable corresponding to the movement of the fixing jig 1. On its upper surface, a mount 8 for solder 9 is provided in a recess, equivalent to the holder 5 in number. The tip of the lead pin 4 in the through-hole 6 of the circuit board 3 is caused to abut against the solder 9 in the mount 8, which results in the capillarity-caused filling with the solder 9 of a gap 10 between the through-hole 6 and lead pin 4, for an easy fixation of the lead pin 4 to the circuit board 3.
申请公布号 JPS62152153(A) 申请公布日期 1987.07.07
申请号 JP19850297587 申请日期 1985.12.25
申请人 TANAKA DENSHI KOGYO KK 发明人 ARAI HISAO
分类号 H01L23/50;H01L21/48;H05K3/30;H05K3/34 主分类号 H01L23/50
代理机构 代理人
主权项
地址