| 摘要 |
PURPOSE:To accomplish sealing with transparent plastic excellent in antimoisture feature without degrading light-transmitting capability by a method wherein a hard-coat film extending as far as a lead frame section stops moisture from infiltrating along the interface between the lead frame and the transparent plastic. CONSTITUTION:A semiconductor 2, which for example is an image sensor or the like requiring transparent seal, is attached to a lead frame 1, wiring is accomplished for the semiconductor device 2 with a wire 3, a transparent resin 4 for molding is applied to include the lead frame 1, semiconductor device 2, and wire 3. On the surface of the transparent resin 4 and on the portion of the lead frame 1 located just outside the transparent resin 4, a hard-coat film 5 is formed. The hard-coat film 5 is a film of SiO2, Si3N4, or other inorganic glass deposited by CVD or spattering, and stops moisture from infiltrating along the interface between the lead frame and transparent plastic. |
