发明名称 POLYPHENYLENE SULFIDE RESIN-SEALED ELECTRONIC PARTS
摘要 PURPOSE:To obtain polyphenylene sulfide resin molded electronic parts with very little leakage current by molding the parts with polyphenylene sulfide resin which is treated by alkaline earth metallate solution and then washed by hot water. CONSTITUTION:Electronic parts are covered or molded with polyphenylene sulfide resin which is washed by hot water after treatment by alkaline earth metallate. There is no ristriction concerning the alkaline earth metallate pro vided that is is water-soluble and, for instance, calcium acetate, calcium chloride, magnesium acetate and the like are preferred. The temperature of the hot water is preferably above 100 deg.C and, especially, the temperature above 170 deg.C is recommended. Water, such as distilled water or deionized water, which contains very little water-soluble electrolyte components is preferred as the water for washing and the electric conductivity of the water is preferably less than 1muupsilon/cm or, more preferably less than 0.5muupsilon/cm. Further, it is recommended to wash the PPS washed by hot water by warm water several times to eliminate residual salts and so forth.
申请公布号 JPS62150751(A) 申请公布日期 1987.07.04
申请号 JP19850290419 申请日期 1985.12.25
申请人 TORAY IND INC 发明人 KOBAYASHI HIROKAZU;KISHIMOTO AKIHIKO
分类号 H01F27/06;C08G75/02;C08G75/06;H01C1/02;H01F27/02;H01G4/224;H01G9/08;H01G9/10;H01L21/56;H01L23/29;H01L23/31 主分类号 H01F27/06
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