| 摘要 |
PURPOSE:To prevent cracks with friction resistance performance as a hard coat film being maintained, by coating at least the surface of the a light emitting or receiving part of a transparent resin with an acrylic resin film. CONSTITUTION:On a lead frame 1, a semiconductor device 2 such as, e.g., a solid state image sensor, a light emitting element or the like, is assembled together with lead wires 3. A transparent plastic mold 4 comprising transparent epoxy resin and the like is applied thereon. An ultraviolet-ray hardened acrylic hard coat film 5 is formed on the surface of the transparent plastic mold. Thus, light is not emitted from flaws due to mechanical friction, and light is not emitted from cracks in the hard coat film due to the difference in thermal expansion between the basis and the molding material. |
