发明名称 RADIATION-CURABLE COMPOSITION
摘要 PURPOSE:To provide the titled compsn. which is highly sensitive and has excellent resolution and resistance to dry etching and heat, consisting of a specified polymer and a bisazide compd. CONSTITUTION:100pts.wt. polymer (A) having a weight-average MW of 3,000-1,000,000, composed of a repeating unit of formula I (wherein R1-R7 are each a 1-20 C alkyl group and at least one of R1-R7 is a 1-4 C alkyl group) [e.g., poly-(8-methyl-1-vinylnapthalene)] is blended with 0.1-20pts.wt. bisazide compd. (B) of formula II (wherein Z is O, S, methylene, vinylene, azo, sulfonyl, keto or a group of formula III, IV or V) and the mixture is dissolved in a solvent to obtain a radiation-curable compsn. The compsn. is applied to a desired substrate while rotating, and heated at 80-250 deg.C for 10-60min to form a thin resist film.
申请公布号 JPS62149741(A) 申请公布日期 1987.07.03
申请号 JP19850290364 申请日期 1985.12.25
申请人 TOSHIBA CORP 发明人 TADA TSUKASA
分类号 C08K5/28;C08F112/00;C08F112/32;C08K5/17;C08L25/02 主分类号 C08K5/28
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