| 摘要 |
PURPOSE:To efficiently monitor a plating line and to improve the plating quality by providing a mechanism which emits an alarm only when there is a material to be plated and when plating conditions are abnormal in the plating line. CONSTITUTION:A chucking state of a lead frame 1 is detected by a sensor 2 in a detecting part 12 for frame chucking and the detection signal is held once in a holding circuit 3. The lead frame 1 is then set to a spot plating mask 4 of a plating stage 13 and is sealed by a sponge 5. Such frame is installed to a power feed pin 7. The frame is immersed in the plating cell and a current and voltage is supplied from a power source 14 to an anode 6 and the pin 7. The timing for the spot plating is taken by a synchronizing signal circuit 8 and the detection signals of an ammeter 15 and voltmeter 16 are discriminated by a current abnormality discriminating circuit 9 and voltage abnormality dis criminating circuit 10. The results thereof and the result of the holding circuit 3 are combined. The alarm is emitted by the alarm device 11 only when the lead frame 1 exists and there is abnormality in the plating conditions.
|
