| 摘要 |
PURPOSE:To make uniform and stable chemical plating by providing shielding materials to segment the inside of a plating cell in which materials to be plated are immersed and blowing gas into the plating liquid to generate the ascending flow of foam along one side of the shielding materials. CONSTITUTION:Many pieces of the materials 2 to be plated such as substrates for printed circuit boards are parallel fixed to fixing jigs 3 and are immersed into the chemical plating liquid in the plating cell 1. The shielding plates 4, 4 to segment the inside of the cell 1 are further provided to both sides of the materials 2. The gas such as air is blown from gas blowing pipes 5 disposed in the bottom of the above-mentioned plating cell 1 so that the ascending flow of the uniform upward plating liquid is generated in the part contg. the materials 2 by the foam ascending along the inside of the plates 4, 4. The uniform and stable chemical plating is thereby executed while the chemical seeds on the surface of the materials 2 is maintained at a uniform concn.. |
