| 摘要 |
<p>PURPOSE:To obtain the module structure of a semiconductor device in which sealing bonded portions are not damaged by a thermal mismatching with high reliability by forming the side plates of a housing of Kovar and a ceiling plate of copper or aluminum. CONSTITUTION:A box-shaped housing 5 for hermetically sealing a semiconductor device 2 is mounted on a ceramic substrate 1, and a cooling jacket 6 for acceler ating the cooling of the device 2 is mounted on the upper surface of the housing 5. Fluid for absorbing heat transmitted to the ceiling plate 5A of the housing 5 by cooling means 8 flows in the jacket 6. The plate 5A of the housing 5 is formed of copper or aluminum, and side plates 5B are formed of Kovar. The contacting surfaces of the plates 5A, 5B are bonded by diffusing, and the contacting surfaces of the plates 5B and the substrate 1 are metallized on both surfaces and then bonded by solder 7. Thus, even if applied by thermal load due to the heat of the device 2, the sealing bonded portions are not damaged by a thermal mismatching to increase the life of the sealed portions.</p> |
