发明名称 PROCESS FOR ADHESION IN MULTI-LAYER STATE FOR MULTI-LAYERED PRINTED CIRCUIT BOARD
摘要 <p>PURPOSE:To maintain the accuracy of positions between circuits and to raise workability, by adhering with pressing under heating after fastening previously with a wire the required number of stacked circuit boards, prepregs, and copper foils. CONSTITUTION:Guide holes 3 are provided at the four corners departed from the circuit area 2 of a circuit board 1, and holes of more than same diameter are opened at the four corners of a prepreg 4 on same positions corresponding to the circuit board. A positioning pin 7 with an air-cylinder at a fastening tool table 6 is lifted and the pin is inserted into the guide holes. Then a pressing board 9 is lowered and presses the positioned circuit board 1 and prepreg 4, and the positioning pin 7 is pulled out. With a fastening tool 10 a wire 11 is struck at A spot on the circuit board 1, prepreg 4, and caulked with a caulking jig A 12 and a caulking jig B 13. A copper foil 14 is stacked above and below the circuit board 1, prepreg 4, then several layers of set hold between panel boards 18 are stacked, and above and below them cushion 17 and plate B 16, cushion 17 and plate A 15 are placed. This is set to a multi-layering adhesion apparatus 19 to be adhered. A dismounted article 20 is unloaded to obtain a product 21 by cutting the wire part.</p>
申请公布号 JPS62144937(A) 申请公布日期 1987.06.29
申请号 JP19850286701 申请日期 1985.12.19
申请人 HITACHI CHEM CO LTD 发明人 WATANABE SHINNOSUKE;SHIOZAKI HARUMI;SASAKI FUMIAKI;TONEGAWA HARUO;MIYATA FUMIO
分类号 H05K3/46;B32B37/00 主分类号 H05K3/46
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