| 摘要 |
PURPOSE:To improve processing speed strikingly in comparison with the case where a groove is machined by sweeping a spotted laser beam, by forming a linear beam from high-energy short-wavelength laser light through an optical system, and machining a groove in each layer of an optical semiconductor device. CONSTITUTION:Light is projected on a film forming substrate 1 from a lateral discharge type excimer laser 2 utilizing ArF or KrF, XeCl and the like. The energy distribution of ultraviolet laser light 3 from said laser is uniform in the lateral direction and forms a Gaussian distribution in the longitudinal direction. The light is converted into a linear laser beam 6 by using two circular cylinder lenses 4 having two curved surfaces and a flat mirror 5. The beam 6 is projected on the film forming substrate 1. The projected part is cut and a groove can be formed in the film in a linear shape. Then the projection is stopped, and the film forming substrate 1 is moved in the direction of an arrow 7 by the required amount. The beam is projected again by the same way, and the linear groove is formed. By repeating this procedure, the machining of strip shaped thin films can be carried out efficiently on the large-area substrate. |
