| 摘要 |
PURPOSE:To shorten a time for handling a wafer and also to prevent the slippage in the position of the orientation flat of the wafer, by replacing a treated wafer by a wafer to be treated in relation to a platen simultaneously substantially, and also by setting the wafer on the platen without using a conveyor belt. CONSTITUTION:A component of a vacuum suction head 20a is provided with a conveyor belt 18a taking out sequentially a wafer 2 to be treated which is held in a carrier 16a and supplying same to said head 20a, and further it is provided with an elevation-type stopper 44 for stopping the wafer 2 and a longitudinally-movable sensor 46 for positioning the orientation flat 3 of the wafer 2. A vacuum suction head 20b is located in the central part of a wafer- holding member of a platen 32 operating as a holder for wafer treatment. This platen 32 is joined to a rotary shaft 34 and is put in an erected state for treatment of the wafer 2 and in a horizontal state for setting and removal (replacement) of the wafer 2. On this occasion, the above-mentioned head 20b is rotated, for instance, together with said platen 32.
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