| 摘要 |
PURPOSE:To reduce the processing steps after lamination of piezoelectric elements and to improve reliability of piezoelectric elements by effecting the connection of each alternate layers of electrode layers through the through-holes formed on positive thin film layers. CONSTITUTION:Electrode layers and piezoelectric thin film layers of lamination type piezoelectric elements are connected alternately and the electrode layers are connected alternately. For these piezoelectric elements, a ceramic raw sheet is used and a hole for a through-hole is processed on this sheet. The connection from lead-out electrodes 13 and 14 arranged respectively on the uppermost sheet 11 and the bottom sheet 12 of the lamination of the piezoelectric elements is performed alternately by use of through-holes 15 and through-hole reliefs 16. At this time, the through-hole connection to an electrode of the next layer which makes a pair is positioned. These are laminated and sintered to fabricate a lamination type piezoelectric element in which the opposite lead-out electrodes 13 and 14 are connected with a small number of steps and its reliability is improved.
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