| 摘要 |
<p>PURPOSE:To facilitate design change including the connection with an external signal by providing a terminal for outside connection on the substrate. CONSTITUTION:An I/O pin 14 for design change and an outside connecting terminal 13 for design change which is connected with the I/O pin 14 for design change are provided on a multilayer ceramic substrate 1 mounted with a semiconductor chip 2 having solder bumps. When this terminal 13 and a pad 8 required by design change is connected with a wire 11, the design change including the connection with an external signal can be easily executed.</p> |
