| 摘要 |
PURPOSE:To use any arbitrary frame pins as grounding pins by composing a lead frame of an island part and a plurality of frame pins separated from the island part. CONSTITUTION:A lead frame 1 is composed of an island part 2 and a plurality of frame pins and the island part 2 and the respective frame pins are separated from each other. A chip 3 is mounted on the island part 2 and bonded with gold bonding wires 5. Some of the frame pins which are used as ground pins 6 are bonded to the island part 2, for instance by spot welding, so as to be connected electrically to the island part 2. On the other hand, the frame pins which are used as inner leads 4 are bonded to the island part 2, for instance with resin adhesive, so as to be isolated electrically from the island part 2. With such bonding processes, the island part 2 and the frame pins are mechanically unified. |
