| 摘要 |
PURPOSE:To join a metallic wire and an electrode excellently without damaging the electrode and a semiconductor chip, and to use the metallic wire, cost thereof is low, in place of a gold wire by setting the amplitude of ultrasonic vibrations to a small value in the first half at the time of bonding and to a large value in the second half. CONSTITUTION:When a ball 10a is formed at the tip section of a copper wire 10 penetrating a capillary chip 5, the ball 10a is pushed against an aluminum electrode 3 on a semiconductor chip 2 by the capillary chip 5 while ultrasonic vibrations having amplitude of A1 are applied to the ball 10a for the time t1. Consequently, the joining of the ball 10a and the aluminum electrode 3 is not started yet, only the ball 10a is deformed, and the contact areas of the ball 10a and the aluminum electrode 3 are extended. Accordingly, when the amplitude of ultrasonic vibrations is increased to A2 from A1 and the ultrasonic vibrations are applied for the time t2, the ball 10a and the aluminum electrode 3 are joined, and another side of the copper wire 10 is switch-bonded with a lead. |
