MODULE MOUNTING STRUCTURE

摘要

PURPOSE:To improve thermal-wear resistant properties and easiness of removing and reconnecting by a method wherein a high power large size chip is mounted on a multilayer substrate with face-down connection and the backside of the chip is cooled. CONSTITUTION:An Si chip 1 is fixed to a carrier substrate 2 of ceramics or the like with solder 4 by flip chip bonding and the gap is filled with resin 3. Terminals which are provided on the backside of the carrier substrate 2 and continuous to through hole conductors 5 of the carrier substrate 2 are bonded to a multilayer substrate 7 with solder 6. The backside of the chip 1 can be cooled by air or water 9 through a cooling plate 12 of metal, ceramics or the like which is heat conducting medium. The temperature cycle accelerated life of a chip carrier structure like this can be ten times of the life of a bare chip structure.