发明名称 REFLOW SOLDERING EQUIPMENT
摘要 PURPOSE:To reduce a vibration at the time of carrying, and to improve the accuracy of solder brazing by using a liquid for carrying a parts assembly body. CONSTITUTION:A soldering equipment is constituted of a heating chamber 11 which has been covered with a cover 8, and a vessel part 7 for containing a high boiling point liquid 4 such as fluorocarbon, etc. The vessel part 7 is extended long in the carrying direction 9 of an assembly body 10 consisting of a substrate to be worked 1 and electronic parts 2, and carried into the heating chamber 11 by pre-heating the assembly body 10 together with a float 3 by using a liquid surface of the liquid 4. In this regard, a heater 5 is installed in the heating chamber 11 and in the liquid 4. According to this reflow soldering equipment, the positioning accuracy can be lowesed by vibration, therefore, the electronic parts, etc., can be soldered precisely.
申请公布号 JPS62134174(A) 申请公布日期 1987.06.17
申请号 JP19850272675 申请日期 1985.12.04
申请人 FUJITSU LTD 发明人 HORIKOSHI EIJI;HASHIMOTO KAORU
分类号 H05K3/34;B23K1/015;B23K3/04 主分类号 H05K3/34
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