PROCESS FOR DEEP ETCHING A SILICON WAFER,申请号USD3499805-传众专利搜索

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发明名称	PROCESS FOR DEEP ETCHING A SILICON WAFER
摘要
申请公布号	US3499805(A)	申请公布日期	1970.03.10
申请号	USD3499805	申请日期	1966.08.29
申请人	AIR FORCE USA	发明人	CHARLES G. BROOKS
分类号	C23F1/02;H01L21/00;H01L21/308;H01L21/368;(IPC1-7):C23F1/02;C23B3/04	主分类号	C23F1/02
代理机构		代理人
主权项
地址

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