发明名称 REFLOW TYPE SOLDERING DEVICE
摘要 PURPOSE:To carry in and carry out a printed circuit board provided with electronic parts on both sides, without causing a contact hindrance, and to curtail a take-out solvent, by turning simultaneously a pair of endless chains with a supporting part to both sides of a device extending over an overall length. CONSTITUTION:An endless chain 61 provided with a supporting member 75 is provided on both sides extending over an overall length of a reflow type soldering device 10, and turned round synchronously by a motor 48. Also, conveyor frames 43, 44 loaded with this endless chain 61 are slid on a guide frame 41 by operating mechanisms 51-59, and width of the endless chain 61 is adjusted to match width of a printed circuit board P. According to this method, even the printed circuit board P provided with electronic parts W on both sides can be carried in and carried out without causing a contact hindrance, in a pre-heater 27, and a vapor tank 11, Also, the consumption of a solvent 15 is curtailed by eliminating an adhesion and a discharge of a fluorine compound inactive solvent vapor 15a such as in case of a conventional net-shaped endless belt.
申请公布号 JPS62130770(A) 申请公布日期 1987.06.13
申请号 JP19850270077 申请日期 1985.11.30
申请人 TAMURA SEISAKUSHO CO LTD 发明人 MASUDA TSUGUNORI;TAKAHASHI TAKAO
分类号 B65G21/14;B23K1/015;B65G17/26;H05K3/34;H05K13/02 主分类号 B65G21/14
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