| 摘要 |
PURPOSE:To relieve overall warping limiting any stress and warp only to selected junction parts on the backside of a semiconductor element by a method wherein the junction parts junctioning a semiconductor element with a mounting part are provided on the selected parts on the backside of the semiconductor element. CONSTITUTION:The junction part of main junction member 3a junctioning a semiconductor element with a diepad 2 is fundamentally situated in the central part within the size range not exceeding 5mm X 5mm while corner junction members 3b are provided with smaller junction part space to be broken down due to stress to some extent. The stress due to the difference in thermal expansion coefficient can be reduced considerably since the junction member 3is composed of the main junction member 3a and partial junctions divided into corner junction parts 3b with reduced space. Furthermore, when the junction member 3 is subjected to any stress, the corner junction members 3b are broken down since this stress as shearing stress is maximized nearly at the corners. Through these procedures, the semiconductor element 1 and the diepad 2 can be relieved under no influence of the stress. |
