| 摘要 |
PURPOSE:To wire bond a predetermined portion without adverse influence to other portion by irradiating a portion to be bonded with a beam to efficiently heat to bond it, thereby stabilizing a bonding strength. CONSTITUTION:A conveyed lead frame 4 is clamped by a clamp 7 to a bonding stage, corrected at its position, and an XY base 2 is then moved to transfer a bonding head to a suitable position. A Z-axis 3 is operated to approach an ultrasonic horn 10 and a capillary 11 are allowed to approach a bonding portion. A laser light 25 is pulse-emitted immediately before the capillary 11 moves to a laser light path. The light 25 is supplied as a thermal energy to operate together with ultrasonic energy of the horn 10 to bond a wire 12 to a predetermined position with sufficient intensity, thereby wire-bonding an element 13 with the lead 4. According to this construction, the irregular temperature of the bonding portion is eliminated to stabilize the strength and to remarkably reduce adverse influence to the other portion. |
