| 摘要 |
A method for sealing a metal electrode into an enamel layer on a metallic carrier is described, the metal electrode being exposed on the surface of the enamel layer and being connected in an electrically conductive manner to a conductor embedded in the enamel layer. In order to produce a point of contact of the metal electrode with the embedded conductor, there is ground in the enamel surface a location whose volume is partly filled with a mixture which consists of metal powder and enamel powder and touches the connection point to the conductor. A metal platelet is pressed onto the mixture. In order to form an electrically conductive connection of sintered metal powder, a first firing pass is then carried out, and after enamel powder has been applied along the edge of the metal platelet and over the surface of the sintered metal, a second firing pass is carried out. The metal platelet preferably consists of rhodium and has a diameter of approximately 2 mm.
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