发明名称 ELECTRONIC DEVICE
摘要 PURPOSE:To enhance freedom of layout of an inner leads, in the parts of the inner leads, which undergo wire bonding, by setting the width on the side of a pellet so that it is larger than the width on the side of an outer lead. CONSTITUTION:A part to be wire-bonded 14 is formed so that a width A of an end part 15 on the side of a tab 7 is larger than a width B of the end part of the side of an outer lead. A best bonding area 20 on each part to be wire- bonded 14 becomes a shaded part. Each pad 4, to which a piece of wire is hooked from said area 20, is positioned in a range 19. Therefore, the range 19 to be selected is expanded since the width A of the end part 15 on the side of the pellet is larger than the width B of the side part on the side of the outer lead. As a result, freedom in selecting the bonding pads 4 is increased. Therefore, the layout of inner leads 8 can be shifted in the longitudinal direction and the like of a DIP 2. The optimum layout of a skinny type DIP can be designed.
申请公布号 JPS62122251(A) 申请公布日期 1987.06.03
申请号 JP19850261131 申请日期 1985.11.22
申请人 HITACHI LTD 发明人 SHIMIZU KAZUO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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