| 摘要 |
PURPOSE:To effectively mount leads on a circuit substrate and to simply regulate the flatness error of leads by forming a conductive member so that the outer ends of the leads may be disposed on the same plane, and correcting the flatness error of the leads. CONSTITUTION:To mount a semiconductor device on a circuit substrate such as a printed substrate, the outer ends 11b of leads 11 of the device are placed at predetermined positions on the substrate. Thus, the ends 11b are so regulated in advance as to be positioned on the same plane by conductive members 15, the all ends are contacted with the substrate surface without fluctuation. Thereafter, the ends 11b of the leads 11 are secured by solder or the like on the substrate. Since the flatness error of the leads 11 in longitudinal direction is corrected by the forming errors of projections 14a formed at the peripheral edges of the bottom of a package 14 and the irregularity of bending the ends 11b of the leads 11, the mounting work can be simply and effectively achieved. |
