Hillock immunization mask.

摘要

An integrated circuit chip having metalization design features that result in greater device reliability. An integrated circuit chip has a plurality of semiconductor layers; at least one metalization layer; and at least one insulating layer which supports the metalization layer. The metalization layer has at least one metallic circuit component characterized in that it has the form of a group of substantially parallel electrically interconnected metallic strips. These metallic strips have a predetermined width and are spaced apart by a predetermined separation distance.