发明名称 METHOD OF REMOVING PROTECTIVE FILM FROM EXPOSED PHOTORESIST FILM OF PRINTED CIRCUIT BOARD
摘要 The apparatus comprises a board-clamping device for clamping a printed circuit board at an edge thereof in a predetermined position, at least one pair of gripping jaws, which can be moved toward and away from the plane of travel for the printed circuit boards by a movement having a component in the peeling direction, which is oblique to the direction of conveyance. The two gripping jaws of said pair are adapted to be closed in that only one jaw of said pair is moved in the peeling direction. Each of the jaws of the pair has an edge which is parallel to the plane of travel and transverse to the peeling direction. Said edge is engageable with the printed circuit board. Said edges of the gripping jaws of said pair define between them a nip. The apparatus also comprises a conveyor, which defines a plane of travel for each printed circuit board and serves to move each printed circuit board to a position in which the printed circuit board is engageable by the gripping jaws of said pair thereof.
申请公布号 JPS62115892(A) 申请公布日期 1987.05.27
申请号 JP19860216961 申请日期 1986.09.12
申请人 RAIL & HEERUMAN GMBH 发明人 GUNTAA HEERUMAN;HANSU GIYUNTAA REERU;YOZEFU BUEE MOOJI
分类号 G03F7/30;B26D3/28;B29B17/02;B29C63/00;B65H41/00;G03F7/00;G03F7/16;H05K3/06 主分类号 G03F7/30
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