Method of making an electronic device using an uniaxial conductive adhesive

摘要

An electronic device made by the method of connecting a circuit member (18) to a substrate (12) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning conductive terminals (20) of the circuit member (18) over preselected ones of conductive paths (16) of the substrate (12). The percent by weight content of the conductive metal particles in the adhesive (22) is concentrated between each conductive terminal (20) and the vertically aligned conductive paths (16) to between forty to fifty percent by weight to decrease the spacing between the metal particles allowing conductivity through the resin and making the resin uniaxially conductive vertically between the conductive terminal (20) and conductive bath (16).