MANUFACTURE OF PRINTED CIRCUIT BOARD

摘要

PURPOSE:To eliminate the damage of a semiconductor chip due to a static electricity charged on an operator to be fed via leads to the chip by mechanically removing a portion crossing the profile finishing line of plated leads prior to the profile finishing. CONSTITUTION:A portion 3a crossing the profile finishing lead L of plated leads 3 continued to a through hole land formed simultaneously on a circuit pattern is mechanically removed by cutting before the profile finishing in profile finishing step. Thereafter, a printed circuit board 2 plated at through holes is obtained by cutting it by pressing along the lead L. A mounting recess 4 of a semiconductor chip is formed by mechanical cutting such as milling on the board 2 to form a semiconductor chip carrier A, a die 5 is bonded to the mounting recess 4 to place a semiconductor chip 6, and electrically connected with a circuit pattern 6 by a wire 7 bonding.