发明名称 ELECTRONIC PART PROVIDED WITH LOW-HARDNESS THIN FILM
摘要 PURPOSE:To protect a first pattern against damage by a method wherein a part or the entirety of the first pattern is covered with a protecting film before the formation of a second pattern. CONSTITUTION:A first pattern 10 is formed on a substrate 3 and then a resin film 12 is formed by photolithography or the like to cover a part of the first pattern 10. A second pattern 11 is then formed by evaporation. In this process, the first pattern 10 and a mask for the formation of the second pattern 11 may contact each other but, owing to the strong resin film of a low friction factor in presence between, the first pattern 10 is protected against damage. The resin film 12 covering a part of the first pattern 10 may be built of a resin belonging to any of the polyimide, polyimide-amide, polyamide, or teflon family. Such a resin may be applied by tape-aided masking or screen printing.
申请公布号 JPS62113427(A) 申请公布日期 1987.05.25
申请号 JP19850254194 申请日期 1985.11.13
申请人 MITSUBISHI ELECTRIC CORP 发明人 KAKINUMA HIROMI
分类号 H01L21/28;H01L21/302;H01L21/3065 主分类号 H01L21/28
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