发明名称 SEALING RESIN COMPOSITION
摘要 PURPOSE:To obtain a sealing resin composition excellent in moisture resistance, thermal cycling resistance and stress resistance, by mixing an epoxy resin with a novolak phenolic resin, a polyarylate resin and an inorganic filler at a specified ratio. CONSTITUTION:A resin composition prepared by mixing an epoxy resin (A) with a novolak phenolic resin (B), a polyarylate resin (C) and an inorganic filler (D) so that 0.1-10wt% component (C) and 25-90wt% component (D) are present in the resin composition. The mixing proportion of the novolak phenolic resin is preferably such that the equivalent ratio of the epoxy groups (a) of the epoxy resin to the phenolic hydroxyl groups (b) of the novolak phenolic resin [(a)/(b)] is in the range of 0.1-10.
申请公布号 JPS62112622(A) 申请公布日期 1987.05.23
申请号 JP19850250961 申请日期 1985.11.11
申请人 TOSHIBA CHEM CORP 发明人 SAWAI KAZUHIRO;KOKUBO MASANORI
分类号 H01L23/29;C08G59/00;C08G59/62;C08K3/00;C08L63/00;C08L67/00;H01B3/40;H01L23/31 主分类号 H01L23/29
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