摘要 |
PURPOSE:To plate partially the inside of the upper branched part of a metallic chip by putting the anode having an insulating coating in the branched part and by supplying an electric current when holes pierced in the coating coincide with the plating positions of the metallic chip. CONSTITUTION:The anode 11 having an insulating coating 12 is put in the space between the projected parts 4 of a female contact 1. The coating 12 has plural holes 13 pierced every pitch of the contact 11 so that current paths are formed during electroplating. The contact 1 is moved with respect to the fixed anode 11. A pulsating current flows every time the holes 13 in the coating 12 confront the projected parts 4 of the contact 1, so partial plating is carried out.
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