| 摘要 |
PURPOSE:To improve cooling capacity by disposing a cap having a spherical shape on one side between an LSI and a stud, and forming the surface of the stud opposed to the cap in a spherical shape matched to the spherical surface of the cap. CONSTITUTION:An LSI substrate 1 on which many LSIs are placed, a cap 3 having a spherical surface on one side on which LSIs 1 are disposed, a stud 4 having a spherical surface on the surface opposed to the spherical surface of the cap 3, a butt 6 having a hole at the position corresponding to the LSIs 1 and pressure-contacted by a special screw mechanism 5 with the stud 4, and a cold plate 8 pressure-contacted with the butt 6 to fed liquid coolant 7 therein are provided, and good thermal conductive compound 9 is filled between the LSI 1 and the cap 3, and between the cap 3 and the stud 4. A gap between the LSI 1 and the cap 3 can be set to almost zero, and thermal resistance can be reduced by filling the compound 9 therebetween. |
