SOLDER COVERING OF ELECTRIC LEAD WIRE,申请号JP19860257133-传众专利搜索

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发明名称	SOLDER COVERING OF ELECTRIC LEAD WIRE
摘要
申请公布号	JPS62108564(A)	申请公布日期	1987.05.19
申请号	JP19860257133	申请日期	1986.10.30
申请人	AMERICAN MICROSYST INC	发明人	JIYON SAN RII
分类号	H01L23/50;H05K3/34;H05K13/04	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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