| 摘要 |
An electrical contact assembly for use as a component of an automated system for testing electronic devices, such as silicon chips. The contact assembly comprises a ring element, a plurality of spring loaded contact probes, an elastic retaining band and alignment pins. The ring element has a plurality of holes that extend through the element from the top to the bottom surfaces, and a groove that encircles the ring element, extending inwardly from its outer peripheral surface, and connects through a small window with each hole. A spring loaded contact probe is positioned in each hole and has a small portion of its surface projecting into the groove through the window associated with each hole. An elastic retaining band is placed in the groove, and partially grasps a portion of the surface of each spring-loaded contact probe, where the surface thereof projects into the groove. Thus, the retaining band maintains each contact probe in position in the ring element, while permitting the contact probe to move in either direction without undue interference. The alignment pins extend outwardly from the bottom surface of the ring element to assist in positioning the contact assembly in an automated testing system.
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