| 摘要 |
PURPOSE:To form a ball automatically so as to continue bonding even if wire is cut, by stopping a bonding head when the ball is not formed with a bonding detecting means, and sequentially extending the wire through a bonding tool. CONSTITUTION:A detected signal is sent to a CPU from a ball detecting circuit 10. When a ball is not formed and wire 2 is cut, the operations of a bonding head and an X-Y table 8 are immediately stopped. Then an electric torch electrode 7 is arranged directly beneath a bonding tool 5 based on a command from the CPU 11. A lower clamper 4 is opened by a clamper driving part 9, and the position of the clamper is lifted and controlled. After the lower clamper 4 is closed, an upper clamper 3 is opened. Then, the wire 2 is held by the lower clamper 4 and lowered. Thus, the wire 2 is protruded from the tip of the bonding tool 5. A high voltage is applied to the electric torch electrode 7 at every specified period as required. When the protruded length of the wire 2 reaches the specified length, the ball is formed. |
