| 摘要 |
An etching method is provided utilizing an organic solvent soluble photosensitive photopolymerized organic film on the surface of an etchable substrate as a negative photoresist. The organic film is applied by effecting the ultraviolet surface photopolymerization of a photopolymerizable organic material in vaporous form, such as hexachlorobutadiene at substrate temperatures below about 100 DEG C. The method allows for the production of composites having continuous and imperforate films having thicknesses as low as 500 Angstroms, which can be employed as negative photoresists and also provide dielectric layers. |
