| 摘要 |
PURPOSE:To align the center of a wafer precisely regardless of variation in the outer diameter of the wafer and the position of an orientation flat by disposing a plurality of cranks at regular intervals on the periphery of a sliding ring surrounding a wafer fitting section and mounting contacts pushing the outer circumferential surface of the wafer in the central direction with the revolution of the cranks at the end sections of each crank. CONSTITUTION:A wafer 25 carried in through a wafer carrying path is sucked by a vacuum chuck 26, and set to a wafer fitting section 24. When an actuator 37 is operated and a shift lever 36 is turned in the direction of the arrow, a sliding ring 23 is rotated in the clockwise direction. Consequently, sliding pins 33 and sliding plates 32 for each lever type contacting mechanism 27... are slid, and cranks 28 are rotated in the counterclockwise direction around pivotal support pins 29. Accordingly, contacts 31... are moved in the central direction of the wafer fitting section 24 and the outer circumferential surface of the wafer 25 is pushed in the central direction of the section 24 from six directions. The wafer 25 is sucked by the vacuum chuck 26 under the state, thus aligning the center of the wafer 25.
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