| 摘要 |
PURPOSE:To miniaturize the soldering device by providing the press mechanism composed of a bellows, etc. and by overflowing the solder from the nozzle port via the pressure to the solder. CONSTITUTION:The press mechanism is composed of the movable body 5 of a bellows, etc. and the motion body 6 which presses. The bellows 5 has a bellows part 7. On the other hand, the opening part 8 is connected to the nozzle feeding port 10 via a flange 9, etc. The bellows 5 at the extension time is filled up by the solder flowed in from the opening part 12. With advancing of the motion body 6, a pressing plate 13 closes the opening part 12 and simultaneously contracts the bellows part 7 with its pressing. In this case, the solder which is pressed at the inner part is overflowed by the fixed quantity by being pushed up onto a nozzle port 4 from a feeding path 10 through a small hole 11. In this way, the whole device can be miniaturized with the feeding of the solder having no pulsating flow and the disusing of a motor, etc. |
